Features : Short manufacturing time, easy for assembly and maintainance.
Limitations : Only for peripheral arrangement
Applications : Logic IC, DDI
Features : Area array arrangement, capable of multi-DUT testing versus cantilever-type
Limitations : High initial cost, long lead time to produce
Applications : DRAM, flash memory, logic IC
Features : High-frequency property (up to 10GHz), high design flexbility
Limitations : Extra pressure needed, weak dimensional stability
Applications : RF IC
Features : Fine needle pitch, high pin count, low probe force
Limitations : High replacement cost
Applications : DRAM, flash memory, logic IC, SoC